Technical Cleaning
Advanced Decontamination for Semiconductor Process Components

We service components exposed to critical process conditions, including: 
PVD / sputtering targets

Process kits and chamber

Shields, liners, cover rings

Plasma-exposed and reactive environment components


Each cleaning cycle is tailored based on material composition, contamination profile, and customer specifications.

Technical Cleaning
Advanced Decontamination for Semiconductor Process Components

We service components exposed to critical process conditions, including: 
PVD / sputtering targets

Process kits and chamber

Shields, liners, cover rings

Plasma-exposed and reactive environment components


Each cleaning cycle is tailored based on material composition, contamination profile, and customer specifications.

Processes & Capabilities

Technical Cleaning & Metal Removal

Our process is designed to ensure:

Selective removal of deposited metals (Al, Ti, Cu, W, etc.)

Elimination of plasma and thin-film residues

Preservation of critical dimensions and surface integrity

Restoration of component functionality and performance


We apply controlled chemical and physico-chemical processes optimized to maximize cleaning efficiency while maintaining substrate integrity.
Precision sandblasting process for surface cleaning and finishing, removing impurities and preparing components for optimal performance and durability.

Electrochemical Pre-Treatment (Electrolysis)

Where required, SMG integrates electrochemical stripping processes as a preliminary phase to enhance metal removal efficiency. 

This step is particularly effective for:

Thick or strongly adhered metallic deposits

Multi-layer contamination stacks

Components exposed to aggressive plasma environments

High-Purity Rinsing Process and Controlled Drying

Following chemical and technical cleaning processes, SMG performs a high-purity rinsing and controlled drying phase to ensure complete removal of residual contaminants and safe preparation for cleanroom handling.

This stage is critical to eliminate any trace of chemicals, particles, or moisture that could compromise component performance in high-sensitivity environments.

The drying cycle is optimized based on material type, geometry, and process requirements.

Controlled Handling for Contamination-Free Delivery

After completion of cleaning and drying processes, components are transferred to a controlled cleanroom environment where handling and packaging are performed under strict contamination control protocols.

This phase is essential to preserve the achieved cleanliness level and ensure that components are delivered ready for immediate use in high-purity environments.

Double Bagging Process

To ensure maximum protection, SMG applies a double bagging (double-layer packaging) system:

- Inner Layer Cleanroom-grade primary bag

- Direct protection of the component

- Sealed in controlled environment


Outer Layer

- Secondary protective bag

- Additional barrier against external contamination

- Designed for safe transport and handling

All packaging materials are selected for low particle release and high purity compatibility.

Controlled Handling for Contamination-Free Delivery

After completion of cleaning and drying processes, components are transferred to a controlled cleanroom environment where handling and packaging are performed under strict contamination control protocols.

This phase is essential to preserve the achieved cleanliness level and ensure that components are delivered ready for immediate use in high-purity environments.

Double Bagging Process

To ensure maximum protection, SMG applies a double bagging (double-layer packaging) system:

- Inner Layer Cleanroom-grade primary bag

- Direct protection of the component

- Sealed in controlled environment


Outer Layer

- Secondary protective bag

- Additional barrier against external contamination

- Designed for safe transport and handling

All packaging materials are selected for low particle release and high purity compatibility.
Technique and knowledge 

In semiconductor manufacturing, metallic contamination and process residues are among the primary drivers of yield loss, process drift, and equipment instability.  

SMG provides high-precision technical cleaning services, specifically engineered for the controlled removal of process metals and critical contaminants from components operating in high-purity environments.

Additional Processes & Capabilities

Chemical Cleaning

Advanced chemical treatments designed for:

Removal of inorganic and organic contaminants

Surface preparation prior to further processing

Controlled etching with high material compatibility

Processes are tailored to ensure maximum efficiency with minimal surface impact.
After chemical cleaning treatment

Alumite Treatment (Anodizing)

Electrochemical surface treatment for aluminum components:

Improved corrosion resistance

Enhanced surface hardness

Controlled oxide layer formation


Widely used for process kits and structural components.
After the alumite treatment

Ceramic Coating

Application of advanced ceramic layers to:

Increase resistance to plasma and chemical attack

Reduce particle generation

Extend component lifetime


Critical for high-wear and plasma-exposed parts.
After ceramic coating layer deposition
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Surface Treatment & Protection

Plasma Arc Spraying

Thermal spray technology used to deposit protective coatings:

High adhesion and dense coating structure

Enhanced durability in harsh environments

Customizable coating materials


Suitable for restoring and upgrading component surfaces.

Particular attention is given to process control and material compatibility. Each coating is developed according to the specific application, taking into account the base material, component geometry and exposure conditions within the process chamber.  

The goal is not only to deposit a coating, but to create a functional surface with controlled properties in terms of adhesion, thickness, and resistance to plasma erosion and chemical attack. The coating process is fully integrated into SMG’s broader workflow, starting from surface preparation, often including controlled abrasive treatments, to ensure optimal adhesion, followed by the coating phase and, where required, finishing operations.

The entire process is supported by quality controls to verify coating integrity and consistency, ensuring that each component meets the required performance standards.

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