We service components exposed to critical process conditions, including:
Technical Cleaning
Advanced Decontamination for Semiconductor Process Components
PVD / sputtering targets
Process kits and chamber
Shields, liners, cover rings
Plasma-exposed and reactive environment components
Each cleaning cycle is tailored based on material composition, contamination profile, and customer specifications.
Process kits and chamber
Shields, liners, cover rings
Plasma-exposed and reactive environment components
Each cleaning cycle is tailored based on material composition, contamination profile, and customer specifications.
Technical Cleaning
Advanced Decontamination for Semiconductor Process Components
We service components exposed to critical process conditions, including:
PVD / sputtering targets
Process kits and chamber
Shields, liners, cover rings
Plasma-exposed and reactive environment components
Each cleaning cycle is tailored based on material composition, contamination profile, and customer specifications.
Process kits and chamber
Shields, liners, cover rings
Plasma-exposed and reactive environment components
Each cleaning cycle is tailored based on material composition, contamination profile, and customer specifications.
Processes & Capabilities
Technical Cleaning & Metal Removal
Our process is designed to ensure:
Selective removal of deposited metals (Al, Ti, Cu, W, etc.)
Elimination of plasma and thin-film residues
Preservation of critical dimensions and surface integrity
Restoration of component functionality and performance
We apply controlled chemical and physico-chemical processes optimized to maximize cleaning efficiency while maintaining substrate integrity.
Selective removal of deposited metals (Al, Ti, Cu, W, etc.)
Elimination of plasma and thin-film residues
Preservation of critical dimensions and surface integrity
Restoration of component functionality and performance
We apply controlled chemical and physico-chemical processes optimized to maximize cleaning efficiency while maintaining substrate integrity.

Precision sandblasting process for surface cleaning and finishing, removing impurities and preparing components for optimal performance and durability.

Electrochemical Pre-Treatment (Electrolysis)
Where required, SMG integrates electrochemical stripping processes as a preliminary phase to enhance metal removal efficiency.
This step is particularly effective for:
Thick or strongly adhered metallic deposits
Multi-layer contamination stacks
Components exposed to aggressive plasma environments
Thick or strongly adhered metallic deposits
Multi-layer contamination stacks
Components exposed to aggressive plasma environments
High-Purity Rinsing Process and Controlled Drying
Following chemical and technical cleaning processes, SMG performs a high-purity rinsing and controlled drying phase to ensure complete removal of residual contaminants and safe preparation for cleanroom handling.
This stage is critical to eliminate any trace of chemicals, particles, or moisture that could compromise component performance in high-sensitivity environments.
This stage is critical to eliminate any trace of chemicals, particles, or moisture that could compromise component performance in high-sensitivity environments.

The drying cycle is optimized based on material type, geometry, and process requirements.
Controlled Handling for Contamination-Free Delivery
After completion of cleaning and drying processes, components are transferred to a controlled cleanroom environment where handling and packaging are performed under strict contamination control protocols.
This phase is essential to preserve the achieved cleanliness level and ensure that components are delivered ready for immediate use in high-purity environments.
Double Bagging Process
To ensure maximum protection, SMG applies a double bagging (double-layer packaging) system:
- Inner Layer Cleanroom-grade primary bag
- Direct protection of the component
- Sealed in controlled environment
Outer Layer
- Secondary protective bag
- Additional barrier against external contamination
- Designed for safe transport and handling
All packaging materials are selected for low particle release and high purity compatibility.
This phase is essential to preserve the achieved cleanliness level and ensure that components are delivered ready for immediate use in high-purity environments.
Double Bagging Process
To ensure maximum protection, SMG applies a double bagging (double-layer packaging) system:
- Inner Layer Cleanroom-grade primary bag
- Direct protection of the component
- Sealed in controlled environment
Outer Layer
- Secondary protective bag
- Additional barrier against external contamination
- Designed for safe transport and handling
All packaging materials are selected for low particle release and high purity compatibility.
Controlled Handling for Contamination-Free Delivery
After completion of cleaning and drying processes, components are transferred to a controlled cleanroom environment where handling and packaging are performed under strict contamination control protocols.
This phase is essential to preserve the achieved cleanliness level and ensure that components are delivered ready for immediate use in high-purity environments.
Double Bagging Process
To ensure maximum protection, SMG applies a double bagging (double-layer packaging) system:
- Inner Layer Cleanroom-grade primary bag
- Direct protection of the component
- Sealed in controlled environment
Outer Layer
- Secondary protective bag
- Additional barrier against external contamination
- Designed for safe transport and handling
All packaging materials are selected for low particle release and high purity compatibility.
This phase is essential to preserve the achieved cleanliness level and ensure that components are delivered ready for immediate use in high-purity environments.
Double Bagging Process
To ensure maximum protection, SMG applies a double bagging (double-layer packaging) system:
- Inner Layer Cleanroom-grade primary bag
- Direct protection of the component
- Sealed in controlled environment
Outer Layer
- Secondary protective bag
- Additional barrier against external contamination
- Designed for safe transport and handling
All packaging materials are selected for low particle release and high purity compatibility.
Technique and knowledge
In semiconductor manufacturing, metallic contamination and process residues are among the primary drivers of yield loss, process drift, and equipment instability.
SMG provides high-precision technical cleaning services, specifically engineered for the controlled removal of process metals and critical contaminants from components operating in high-purity environments.
Additional Processes & Capabilities
Chemical Cleaning
Advanced chemical treatments designed for:
Removal of inorganic and organic contaminants
Surface preparation prior to further processing
Controlled etching with high material compatibility
Processes are tailored to ensure maximum efficiency with minimal surface impact.
Removal of inorganic and organic contaminants
Surface preparation prior to further processing
Controlled etching with high material compatibility
Processes are tailored to ensure maximum efficiency with minimal surface impact.

After chemical cleaning treatment
Alumite Treatment (Anodizing)
Electrochemical surface treatment for aluminum components:
Improved corrosion resistance
Enhanced surface hardness
Controlled oxide layer formation
Widely used for process kits and structural components.
Improved corrosion resistance
Enhanced surface hardness
Controlled oxide layer formation
Widely used for process kits and structural components.

After the alumite treatment
Ceramic Coating
Application of advanced ceramic layers to:
Increase resistance to plasma and chemical attack
Reduce particle generation
Extend component lifetime
Critical for high-wear and plasma-exposed parts.
Increase resistance to plasma and chemical attack
Reduce particle generation
Extend component lifetime
Critical for high-wear and plasma-exposed parts.

After ceramic coating layer deposition
Request SOW and Quote
Enter your details and we will be in touch to discuss your project.
Surface Treatment & Protection

Plasma Arc Spraying
Thermal spray technology used to deposit protective coatings:
High adhesion and dense coating structure
Enhanced durability in harsh environments
Customizable coating materials
Suitable for restoring and upgrading component surfaces.
Particular attention is given to process control and material compatibility. Each coating is developed according to the specific application, taking into account the base material, component geometry and exposure conditions within the process chamber.
The goal is not only to deposit a coating, but to create a functional surface with controlled properties in terms of adhesion, thickness, and resistance to plasma erosion and chemical attack. The coating process is fully integrated into SMG’s broader workflow, starting from surface preparation, often including controlled abrasive treatments, to ensure optimal adhesion, followed by the coating phase and, where required, finishing operations.
The entire process is supported by quality controls to verify coating integrity and consistency, ensuring that each component meets the required performance standards.
The entire process is supported by quality controls to verify coating integrity and consistency, ensuring that each component meets the required performance standards.
Request valuation project
Send a request our Team will contact You in 24 hours.
